We build an input layer for the era of AI and Autonomy,
deployable in the real world.We build the manufacturing
platform for chip scale quantum.

Advancing how machines sense, understand, and interact with the world is mission to true autonomy.

Unifying all sensors into one coherent system that delivers high-fidelity, actionable intelligence.

To ensure high-performance but reliable application, packaging should be in form of chip. Same applies to quantum technology.
Arrakis Technologies enables quantum hardware to become a manufacturable, deployable system through packaging.
Chip-scale photonic integration and scalable packaging are prerequisites for any quantum technology to reach market.
Ideal for early-stage builders who want to launch fast with enterprise-grade protection.
Built for startups that need reliable, scalable security without slowing down growth.
Designed for teams that prioritize robust security, compliance, and resilience.

Chip-scale photonic integration and scalable packaging are prerequisites for any quantum technology to reach market.
Sensor metrics are packaged with calibration, status, and confidence for system-ready perception outputs. The interface scales from single sensors to sensor-fusion modules.
.png)
Closed-loop electronics control lasers and thermal systems while acquiring and conditioning photodiode signals. Raw readout is converted into calibrated sensor metrics.
.png)
On-chip lasers and frequency control deliver tightly stabilized light to drive and interrogate the atomic system.
.png)
A microfabricated atomic vapor cell defines the neutral-atom sensing region and quantum reference. Integrated thermal control holds the operating point and suppresses drift.
.png)
High-speed photodiodes convert quantum optical signals into low-noise electrical data for precise real-time measurement and control.
.png)
A System-in-Package enclosure unifies all layers into one manufacturable quantum sensor chip.
