The packaging platform
for Photonics Chip
We don't design chips.
We make everyone else's chips work.
Wafer-level packaging platform for the optical transition.
The chip exists
The physics works
Packaging kills productization
We control heat & precision for photon & fiber
Chip-scale photonicintegration and scalable packaging are prerequisites for any quantum technologyto reach market.
Revenue Anchor
Precision meets wafer
Precision packaging for optical MEMS. Specialized in defense and robotics. Revenue in scalable market today.
Differentiation Play
Quantum backed by photon
Quantum technology backed by photonics integrated circuits. Thermal control, Vacuum, and alignment make quantum-level precision.
Growth Engine
Co-Packaged Optics (CPO)
Modern AI datacenter suffer from heat and bandwidth problem. Our CPO aims to enter hyperscaler supply chain with proven credentials.
Our quantum-native stack solves what standard packaging cannot
Standard packaging was built for electronics. Photonics demands precision that electronics never required — and our platform was engineered from day one to deliver it.
Thermal Management
Active thermal management designed into the substrate, not bolted on after the fact.~1,300 K/W isolation through thin Si beams. Laser die and ASIC coexist without crosstalk.
Hermetic Sealing
Wafer-level batch sealing that meets military-grade reliability without per-unit manual assembly.Wafer-level bonding. MIL-STD compliant hermeticity.
Lithographic Alignment
Sub-micron optical alignment defined by lithography, replacing skilled operators with repeatable physics.
One company
One platform
Three stuck markets
Six Integrated Layers
Perception Output Layer
Sensor metrics are packaged with calibration, status, and confidence for system-ready perception outputs. The interface scales from single sensors to sensor-fusion modules.
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Control & Acquisition Layer
Closed-loop electronics control lasers and thermal systems while acquiring and conditioning photodiode signals. Raw readout is converted into calibrated sensor metrics.
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Integrated Photonics Layer
On-chip lasers and frequency control deliver tightly stabilized light to drive and interrogate the atomic system.
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Neutral-Atom Core Layer
A microfabricated atomic vapor cell defines the neutral-atom sensing region and quantum reference. Integrated thermal control holds the operating point and suppresses drift.
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Optical Readout Layer
High-speed photodiodes convert quantum optical signals into low-noise electrical data for precise real-time measurement and control.
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System-in-Package Shield
A System-in-Package enclosure unifies all layers into one manufacturable quantum sensor package.
